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「Printing, coating processes」related product list
BF-X2MC
WINSTAT Series
Semiconductors/Electronic devicesLCD panelsAssembly processesPC board mounting processesInspection processesPrinting, coating processesWrapping/Packaging processesResin moldsFilmsGlassDust, foreign matterParts feedersShort range
BF-XMB
WINSTAT Series
Semiconductors/Electronic devicesLCD panelsAssembly processesPC board mounting processesInspection processesPrinting, coating processesWrapping/Packaging processesResin moldsFilmsGlassDust, foreign matterParts feedersShort rangeSpace-saving
BF-X2ME
WINSTAT Series
Semiconductors/Electronic devicesLCD panelsAssembly processesPC board mounting processesInspection processesPrinting, coating processesWrapping/Packaging processesResin moldsFilmsGlassDust, foreign matterParts feedersShort range
BF-X4MB
WINSTAT Series
Semiconductors/Electronic devicesLCD panelsAssembly processesPC board mounting processesInspection processesPrinting, coating processesWrapping/Packaging processesResin moldsFilmsGlassDust, foreign matterParts feedersShort range
BF-6MB
WINSTAT Series
Semiconductors/Electronic devicesLCD panelsAssembly processesPC board mounting processesInspection processesPrinting, coating processesWrapping/Packaging processesResin moldsFilmsGlassDust, foreign matterParts feedersShort range
BF-OHP3B
WINSTAT Series
Semiconductors/Electronic devicesLCD panelsAssembly processesPC board mounting processesInspection processesPrinting, coating processesWrapping/Packaging processesResin moldsFilmsGlassDust, foreign matterParts feedersShort range
BF-XZB
WINSTAT Series
LCD panelsAssembly processesPC board mounting processesInspection processesPrinting, coating processesWrapping/Packaging processesResin moldsFilmsGlassDust, foreign matterParts feedersShort rangeSpace-saving
BF-X2ZB-V2
WINSTAT Series
LCD panelsAssembly processesPC board mounting processesInspection processesPrinting, coating processesWrapping/Packaging processesResin moldsFilmsGlassDust, foreign matterParts feedersShort range
BF-X4ZB
WINSTAT Series
LCD panelsAssembly processesPC board mounting processesInspection processesPrinting, coating processesWrapping/Packaging processesResin moldsFilmsGlassDust, foreign matterParts feedersShort range
ZappⅡ
PIEZONIZER Series
Semiconductors/Electronic devicesLCD panelsAssembly processesPC board mounting processesInspection processesPrinting, coating processesWrapping/Packaging processesResin moldsFilmsGlassLensesDust, foreign matterParts feedersShort rangeSpace-saving
ZappⅡ-L
PIEZONIZER Series
Semiconductors/Electronic devicesLCD panelsAssembly processesPC board mounting processesInspection processesPrinting, coating processesWrapping/Packaging processesResin moldsFilmsGlassLensesDust, foreign matterParts feedersShort rangeSpace-saving
![AG-5 [Air type] ELIMINOSTAT Series](https://www.shishido-esd.co.jp/en/wp-content/uploads/sites/2/2019/01/ag-5.jpg)
AG-5 [Air type]
ELIMINOSTAT Series
LCD panelsAssembly processesPC board mounting processesInspection processesPrinting, coating processesWrapping/Packaging processesResin moldsFilmsGlassDust, foreign matterShort range
![BUAS [Air type] ELIMINOSTAT Series](https://www.shishido-esd.co.jp/en/wp-content/uploads/sites/2/2019/01/buas.jpg)
BUAS [Air type]
ELIMINOSTAT Series
LCD panelsAssembly processesPC board mounting processesInspection processesPrinting, coating processesWrapping/Packaging processesResin moldsFilmsGlassDust, foreign matterLong rangeSpace-saving
![FAPS-GP [Air type] ELIMINOSTAT Series](https://www.shishido-esd.co.jp/en/wp-content/uploads/sites/2/2019/01/faps-gp.jpg)
FAPS-GP [Air type]
ELIMINOSTAT Series
LCD panelsAssembly processesPC board mounting processesInspection processesPrinting, coating processesWrapping/Packaging processesResin moldsFilmsGlassDust, foreign matterLong range