「Semiconductors/Electronic devices」related product list

BF-XME
WINSTAT Series
Semiconductors/Electronic devicesLCD panelsAssembly processesPC board mounting processesInspection processesWrapping/Packaging processesResin moldsFilmsGlassDust, foreign matterParts feedersShort rangeSpace-savingPrintingcoating processesforeign matter

BF-X4ME
WINSTAT Series
Semiconductors/Electronic devicesLCD panelsAssembly processesPC board mounting processesInspection processesWrapping/Packaging processesResin moldsFilmsGlassDust, foreign matterParts feedersShort rangePrintingcoating processesforeign matter

ZappⅢ
AC-type compact ionizer, with mini-piezoelectric transformer built-in
Semiconductors/Electronic devicesLCD panelsAssembly processesPC board mounting processesInspection processesWrapping/Packaging processesResin moldsFilmsGlassLensesDust, foreign matterParts feedersShort rangeSpace-savingPrintingcoating processesforeign matter

BF-X2MC
WINSTAT Series
Semiconductors/Electronic devicesLCD panelsAssembly processesPC board mounting processesInspection processesPrinting, coating processesWrapping/Packaging processesResin moldsFilmsGlassDust, foreign matterParts feedersShort range

BF-XMB
WINSTAT Series
Semiconductors/Electronic devicesLCD panelsAssembly processesPC board mounting processesInspection processesPrinting, coating processesWrapping/Packaging processesResin moldsFilmsGlassDust, foreign matterParts feedersShort rangeSpace-saving

BF-X2ME
WINSTAT Series
Semiconductors/Electronic devicesLCD panelsAssembly processesPC board mounting processesInspection processesPrinting, coating processesWrapping/Packaging processesResin moldsFilmsGlassDust, foreign matterParts feedersShort range

BF-X4MB
WINSTAT Series
Semiconductors/Electronic devicesLCD panelsAssembly processesPC board mounting processesInspection processesPrinting, coating processesWrapping/Packaging processesResin moldsFilmsGlassDust, foreign matterParts feedersShort range

BF-6MB
WINSTAT Series
Semiconductors/Electronic devicesLCD panelsAssembly processesPC board mounting processesInspection processesPrinting, coating processesWrapping/Packaging processesResin moldsFilmsGlassDust, foreign matterParts feedersShort range

BF-OHP3B
WINSTAT Series
Semiconductors/Electronic devicesLCD panelsAssembly processesPC board mounting processesInspection processesPrinting, coating processesWrapping/Packaging processesResin moldsFilmsGlassDust, foreign matterParts feedersShort range

ZappⅡ
PIEZONIZER Series
Semiconductors/Electronic devicesLCD panelsAssembly processesPC board mounting processesInspection processesPrinting, coating processesWrapping/Packaging processesResin moldsFilmsGlassLensesDust, foreign matterParts feedersShort rangeSpace-saving

ZappⅡ-L
PIEZONIZER Series
Semiconductors/Electronic devicesLCD panelsAssembly processesPC board mounting processesInspection processesPrinting, coating processesWrapping/Packaging processesResin moldsFilmsGlassLensesDust, foreign matterParts feedersShort rangeSpace-saving

CABX
ELIMINOSTAT Series
Semiconductors/Electronic devicesLCD panelsAssembly processesPC board mounting processesInspection processesWrapping/Packaging processesResin moldsFilmsGlassDust, foreign matterParts feedersShort rangePrintingcoating processesforeign matter

DC-ESR-C
ELIMINOSTAT Series
Semiconductors/Electronic devicesDust, foreign matterLong rangeNo blowingCleanroomforeign matter