「Semiconductors/Electronic devices」related product list
BF-XME
WINSTAT Series
Semiconductors/Electronic devicesLCD panelsAssembly processesPC board mounting processesInspection processesWrapping/Packaging processesResin moldsFilmsGlassDust, foreign matterParts feedersShort rangeSpace-savingPrintingcoating processesforeign matter
BF-X4ME
WINSTAT Series
Semiconductors/Electronic devicesLCD panelsAssembly processesPC board mounting processesInspection processesWrapping/Packaging processesResin moldsFilmsGlassDust, foreign matterParts feedersShort rangePrintingcoating processesforeign matter
ZappⅢ
AC-type compact ionizer, with mini-piezoelectric transformer built-in
Semiconductors/Electronic devicesLCD panelsAssembly processesPC board mounting processesInspection processesWrapping/Packaging processesResin moldsFilmsGlassLensesDust, foreign matterParts feedersShort rangeSpace-savingPrintingcoating processesforeign matter
BF-X2MC
WINSTAT Series
Semiconductors/Electronic devicesLCD panelsAssembly processesPC board mounting processesInspection processesPrinting, coating processesWrapping/Packaging processesResin moldsFilmsGlassDust, foreign matterParts feedersShort range
BF-XMB
WINSTAT Series
Semiconductors/Electronic devicesLCD panelsAssembly processesPC board mounting processesInspection processesPrinting, coating processesWrapping/Packaging processesResin moldsFilmsGlassDust, foreign matterParts feedersShort rangeSpace-saving
BF-X2ME
WINSTAT Series
Semiconductors/Electronic devicesLCD panelsAssembly processesPC board mounting processesInspection processesPrinting, coating processesWrapping/Packaging processesResin moldsFilmsGlassDust, foreign matterParts feedersShort range
BF-X4MB
WINSTAT Series
Semiconductors/Electronic devicesLCD panelsAssembly processesPC board mounting processesInspection processesPrinting, coating processesWrapping/Packaging processesResin moldsFilmsGlassDust, foreign matterParts feedersShort range
BF-6MB
WINSTAT Series
Semiconductors/Electronic devicesLCD panelsAssembly processesPC board mounting processesInspection processesPrinting, coating processesWrapping/Packaging processesResin moldsFilmsGlassDust, foreign matterParts feedersShort range
BF-OHP3B
WINSTAT Series
Semiconductors/Electronic devicesLCD panelsAssembly processesPC board mounting processesInspection processesPrinting, coating processesWrapping/Packaging processesResin moldsFilmsGlassDust, foreign matterParts feedersShort range
ZappⅡ
PIEZONIZER Series
Semiconductors/Electronic devicesLCD panelsAssembly processesPC board mounting processesInspection processesPrinting, coating processesWrapping/Packaging processesResin moldsFilmsGlassLensesDust, foreign matterParts feedersShort rangeSpace-saving
ZappⅡ-L
PIEZONIZER Series
Semiconductors/Electronic devicesLCD panelsAssembly processesPC board mounting processesInspection processesPrinting, coating processesWrapping/Packaging processesResin moldsFilmsGlassLensesDust, foreign matterParts feedersShort rangeSpace-saving
CABX
ELIMINOSTAT Series
Semiconductors/Electronic devicesLCD panelsAssembly processesPC board mounting processesInspection processesWrapping/Packaging processesResin moldsFilmsGlassDust, foreign matterParts feedersShort rangePrintingcoating processesforeign matter
DC-ESR-C
ELIMINOSTAT Series
Semiconductors/Electronic devicesDust, foreign matterLong rangeNo blowingCleanroomforeign matter